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Failure-Free Integrated
Circuit Packages - $98.95
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SPOT, STOP, AND ANALYZE IC
DEVICE FAILURE WITH THIS UNIQUE ILLUSTRATED GUIDE
Worth more than a thousand words, each illustration in
Failure- Free Integrated Circuit Packages gives you a
visual reference on common failure modes of IC devices in
organic packages.
In addition, the wide
knowledge base of the chapter authors provides you with
proven, leading-edge failure analysis techniques.
Failure-Free Integrated Circuit Packages helps you:
- Find, identify, and
correct potential failures before they occur
- Improve device
reliability
- Learn from case studies
of IC package failure modes
- Quickly locate failures
through visual comparisons
- Apply state-of-the-art
failure analysis techniques
- Comprehend the physics
behind the failure mechanism
- Understand the
limitations of reliability testing and lifetime
estimation
INSIDE, YOU’LL FIND A
PRACTICAL AND EASY WAY TO APPROACH FAILURE ANALYSIS OF ICs
IN ORGANIC PACKAGES. AREAS COVERED INCLUDE:
- Fundamentals of IC
package technologies
- Reliability
- Physics and chemistry of
failures in packaged devices
- Strategies for locating
failures
- Failure analysis
techniques
- Failure modes common in
organic IC packages
- Emerging assembly
materials for IC packaging
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