This well-established and well-regarded reference work offers unique, single-source coverage of most major topics related to the performance and failure of materials used in electronic devices and electronics packaging.

With a focus on statistically predicting failure and product yields, this book can help the design engineer, manufacturing engineer and quality control engineer all better understand the common mechanisms that lead to electronics materials failures, including dielectric breakdown, hot-electron effects and radiation damage.

This new edition will add cutting edge knowledge gained in both research labs and on the manufacturing floor, with new sections on plastics and other new packaging materials, new testing procedures, and new coverage of MEMS devices.

Audience
Professional Materials Engineers working with materials used in electronic devices, including silicon chips; Electronics Engineers; Electrical Engineers; Manufacturing Engineers; Chemical Engineers